Mini Oven 04S BGA Reballer & Prebumping

For BGA Reballing and Prebumping of SMD Components

The MINIOVEN 04 is perfectly suited for a wide range of applications, from prebumping small QFNs to BGA reballing.

An extensive selection of stencils and masks for almost any standard chip and a design and manufacture service ensures you are supplied with the stencils and masks for all your applications.

This allows for all your BGA reballing and QFN prebumping needs.

 
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Mini Oven 04N (Nitrogen Option) BGA Reballer & Prebumping

For BGA Reballing and Prebumping of SMD Components

The MINIOVEN 04 is perfectly suited for a wide range of applications, from prebumping small QFNs to BGA reballing.

An extensive selection of stencils and masks for almost any standard chip and a design and manufacture service ensures you are supplied with the stencils and masks for all your applications.

This allows for all your BGA reballing and QFN prebumping needs.

 
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BGA Reball-04 Set PS3
LW50 9002

Reballing-Holder 45 x 45 mm² with Spring Loaded Clamps

3 Masks for PS3 BGA reballing, Pitch 1.00 mm

 
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BGA Reball-04 Set Standard
LW50 9001

Includes:
• BGA Reballing-Holder 45 x 45 mm²
• BGA Reballing Frame Set for BGAs (7 pcs)

4 BGA Reballing Masks for reballing BGAs with Pitch 1.00 mm and 1.27 mm

 
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QFN Prebump-04 Set
SF29 0002

 
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